PAGE CONTENTS
Objectives
This project aims to develop an advanced photodiode concept able to overcome the power handling limitations of a standard photodiode. Advanced packaging concepts are proposed for heat dissipation and cooling of the photodiode chip and for efficient light coupling to the active photodiode area. Preliminary environmental testing, such as gamma and proton irradiation testing, are conducted to identify the suitability of the technology platform for space born applications.
Challenges
Operation of a photodiode under high optical input power is challenging. First, because the optical induced space charge effects limits the O/E performance such as the RF output power and linearity of the device. Second, due to the high photocurrent and elevated bias voltage the dissipated power within the device increases which may lead to thermally induced damage.
Plan
The first phase included a review of materials, technologies and concepts for the implementation of the photoreceiver, the sub-assembly and the package (PDR, MS1).
In the second phase, specific test structures have been developed and manufactured, which allowed to develop a more detailed and accurate electrical and thermal simulation model and to create a detailed design. (DDR, MS2).
In the third phase, the high power photodiode chip, sub-assembly and assembly have been manufactured and tested according to the test plan (TRB, MS3).
The conclusion of the project has been presented in the final review meeting (FR, MS4, MS1-CCN).
Current Status
The final review (FR) of the project has been successful and all deliverables accepted.
Companies
