PAGE CONTENTS
Objectives
The AutoMAIT project focuses on creating automated processes for attaching micro-optic to photonic integrated circuits (PICs) aimed at satellite applications. Objectives include enhancing assembly reliability and repeatability, improving optical coupling efficiency, reducing manual degrees of freedom, and developing processes that withstand harsh environmental conditions like thermal cycling and vibration. The project advances these packaging processes to a technology readiness level (TRL5), enabling high-volume manufacturing for the price-sensitive Non-Geostationary Orbit (NGSO) market and supporting MBRYONICS’ STARCOM and TeraBIX product lines.
Challenges
The AutoMAIT project encompasses challenges in developing automated micro-optic attachment processes for photonic integrated circuits. Key issues include achieving reliable and repeatable assembly, reducing the degrees of freedom in current processes, and improving optical coupling efficiency. Ensuring the processes and components could withstand harsh environmental conditions, like thermal cycling and vibration, was also a significant hurdle. The report also discusses the need for future production automation to meet market demands.
System Architecture
The AutoMAIT system focuses on automating the micro-optic attachment process for photonic integrated circuits (PICs) used in satellite applications. The core of the system revolves around a Finetech Lambda 2 flip-chip bonder, which provides precise placement and alignment capabilities. This bonder is enhanced with custom-designed fixtures for thermal bonding and environmental testing.
The architecture includes automated epoxy dispensing for controlled application of adhesive. Optical feedback mechanisms are integrated for real-time monitoring and optimization of optical coupling during the alignment process. Specifically designed PICs, lensed fibre arrays, and various epoxy types are key components. The system undergoes rigorous post-process testing, including die shear, mechanical shock and vibration, thermal cycling, and TVAC (thermal vacuum) testing to ensure reliability in harsh space environments.
Plan
The AutoMAIT project phases include developing flip-chip based micro-lens and fibre array attachment processes for photonic integrated circuits. Key milestones involve design considerations for reduced degrees of freedom in optical alignment, automated epoxy deposition, and curing processes. Post-process testing was conducted, including die shear, mechanical shock and vibration, thermal cycling, and TVAC testing to evaluate the processes’ effectiveness and environmental resilience for satellite applications. Additionally, the project included roadmapping and business development strategies for future automation and market engagement.
Current Status
The AutoMAIT project has developed and tested automated photonic packaging processes for satellite communications, focusing on improving optical coupling efficiency and reliability for high-volume manufacturing. Testing, including die shear, mechanical shock, vibration, thermal cycling, and TVAC, has been completed. The report also outlines future roadmapping and business development strategies, including plans for production automation, market analysis, and customer engagement, with a focus on supporting MBRYONICS’ STARCOM and TeraBIX product lines.